Thermal design power

The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload.

Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating.^[1]

Intel has introduced a new metric called scenario design power (SDP) for some Ivy Bridge Y-series processors.^[2]^[3]

^ John L. Hennessy; David A. Patterson (2012). Computer Architecture: A Quantitative Approach (5th ed.). Elsevier. p. 22. ISBN 978-0-12-383872-8.
^ Anand Lal Shimpi (2013-01-14). "Intel Brings Core Down to 7W, Introduces a New Power Rating to Get There: Y-Series SKUs Demystified". anandtech.com. Retrieved 2014-02-11.
^ Crothers, Brooke (2013-01-09). "Intel responds to cooked power efficiency claims". ces.cnet.com. Retrieved 2014-02-11.

[HennessyPatterson2012-1] John L. Hennessy; David A. Patterson (2012). Computer Architecture: A Quantitative Approach (5th ed.). Elsevier. p. 22. ISBN 978-0-12-383872-8.

[anandtech-6655-2] Anand Lal Shimpi (2013-01-14). "Intel Brings Core Down to 7W, Introduces a New Power Rating to Get There: Y-Series SKUs Demystified". anandtech.com. Retrieved 2014-02-11.

[3] Crothers, Brooke (2013-01-09). "Intel responds to cooked power efficiency claims". ces.cnet.com. Retrieved 2014-02-11.

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