Universal Chiplet Interconnect Express (UCIe) is an open specification for a die-to-die interconnect and serial bus between chiplets. It is co-developed by AMD, Arm, ASE Group, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC.[1]
In August 2022, Alibaba Group and Nvidia joined as board members.[2]
- ^ "About UCIe". uciexpress.org. Retrieved 2022-03-31.
- ^ "UCIe Announces Incorporation and New Board Members at FMS 2022". uciexpress.org. Retrieved 2022-12-14.
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