Chemical-mechanical polishing

Chemical mechanical polishing (CMP) (also called chemical mechanical planarization) is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing.^[1] It is used in the semiconductor industry to polish semiconductor wafers as part of the integrated circuit manufacturing process.^[2]

^ Mahadevaiyer Krishnan, Jakub W. Nalaskowsk, and Lee M. Cook, "Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms" Chem. Rev., 2010, vol. 110, pp 178–204. doi:10.1021/cr900170z
^ Oliver, Michael R., ed. (2004). "Chemical-Mechanical Planarization of Semiconductor Materials". Springer Series in Materials Science. doi:10.1007/978-3-662-06234-0. ISSN 0933-033X.

[1] Mahadevaiyer Krishnan, Jakub W. Nalaskowsk, and Lee M. Cook, "Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms" Chem. Rev., 2010, vol. 110, pp 178–204. doi:10.1021/cr900170z

[2] Oliver, Michael R., ed. (2004). "Chemical-Mechanical Planarization of Semiconductor Materials". Springer Series in Materials Science. doi:10.1007/978-3-662-06234-0. ISSN 0933-033X.

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