Draft:Direct Atomic Layer Processing

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Direct Atomic layer processing(DALP), is a subset technique of Atomic Layer Deposition(ALD) and Atomic Layer Etching(ALE), utilizing the same surface chemical principles as these methods. Processing is used to indicate that both ALD and ALE are possible, making both deposition and etching possible. More specifically it is a subset of Spatial Atomic Layer Deposition, where DALP employs micro-nozzles to precisely control localized processing n in three-dimensional space (XYZ), enabling micro-spot deposition/etching, as illustrated in Figure 1.