Back LGA 3647 Catalan Sockel 3647 German LGA 3647 Spanish LGA3647 Japanese LGA 3647 Korean LGA 3647 Russian LGA 3647 Turkish LGA 3647 Ukrainian LGA 3647 Chinese
 | |
| Release date | 2016 |
|---|---|
| Designed by | Intel |
| Manufactured by | Lotes |
| Type | LGA-ZIF |
| Chip form factors | Flip-chip |
| Contacts | 3647 |
| FSB protocol | |
| Processor dimensions | 76.0mm × 56.5mm 4,294mm2 |
| Processors | |
| Predecessor | LGA 2011 |
| Variant | LGA 2066 (HEDTs and workstations) |
| Successor | LGA 4189 |
| Memory support | DDR4 |
This article is part of the CPU socket series | |
LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200 ("Knights Landing"),[1] Xeon Phi 72x5 ("Knights Mill"), Skylake-SP, Cascade Lake-SP, and Cascade Lake-W microprocessors.[2]
The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for Quick Path Interconnect (QPI), and 100G Omni-Path interconnect and also has a new mounting mechanism which does not use a lever to secure it in place but the CPU cooler's pressure and its screws to secure it in place.
- ^ Alcorn, Paul (June 20, 2016). "Intel Xeon Phi Knights Landing Now Shipping; Omni Path Update, Too". Tom's Hardware. Retrieved November 14, 2022.
- ^ Alcorn, Paul (June 3, 2016). "Skylake Xeon Platforms Spotted, Purley Makes A Quiet Splash At Computex". Tom's Hardware. Retrieved November 14, 2022.
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