14 nm process

Semiconductor device fabrication
MOSFET scaling (process nodes)
020 µm – 1968 010 µm – 1971 006 µm – 1974 003 µm – 1977  1.5 µm – 1981 001 µm – 1984 800 nm – 1987 600 nm – 1990 350 nm – 1993 250 nm – 1996 180 nm – 1999 130 nm – 2001 090 nm – 2003 065 nm – 2005 045 nm – 2007 032 nm – 2009 028 nm – 2010 022 nm – 2012 014 nm – 2014 010 nm – 2016 007 nm – 2018 005 nm – 2020 003 nm – 2022
Future 002 nm ~ 2024
Half-nodes Density CMOS Device (multi-gate) Moore's law Transistor count Semiconductor Industry Nanoelectronics
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The "14 nanometer process" refers to a marketing term for the MOSFET technology node that is the successor to the "22 nm" (or "20 nm") node. The "14 nm" was so named by the International Technology Roadmap for Semiconductors (ITRS). Until about 2011, the node following "22 nm" was expected to be "16 nm". All "14 nm" nodes use FinFET (fin field-effect transistor) technology, a type of multi-gate MOSFET technology that is a non-planar evolution of planar silicon CMOS technology.

Since at least 1997, "process nodes" have been named purely on a marketing basis, and have no relation to the dimensions on the integrated circuit;^[1] neither gate length, metal pitch or gate pitch on a "14nm" device is fourteen nanometers.^[2][3][4] For example, TSMC and Samsung's "10 nm" processes are somewhere between Intel's "14 nm" and "10 nm" processes in transistor density, and GlobalFoundries' "7 nm" processes are dimensionally similar to Intel's "10 nm" process.^[5]

Samsung Electronics taped out a "14 nm" chip in 2014, before manufacturing "10 nm class" NAND flash chips in 2013.^{[dubious – discuss][clarification needed]} The same year, SK Hynix began mass-production of "16 nm" NAND flash, and TSMC began "16 nm" FinFET production. The following year, Intel began shipping "14 nm" scale devices to consumers.^{[needs update]}